0
year
Professional imaging experience

Dedicated to pulse thermocompression bonding for 20 years, we have independently developed a core temperature-control system and can integrate with fully automated production lines, maintaining deep partnerships with 2,000 globally renowned clients.

Kaimujin offers a range of competitive chip-packaging technologies, including QFN and BGA, as well as specialized packaging for imaging‑grade chips, and holds an exclusive patent for PLCC packaging technology.